Applications :
cutting & engraving

  • Tool diameter down to 20 μm

  • Laserbeam precision ±2 μm in x,y,z, and ±2 μrad in θ

  • No deformation of the part / material

  • No impact

  • No impact on the material’s integrity

  • No oxydation

  • Layer by layer micrometric matter removal

Applications :
marking

Color separation through diffraction grating

Periodical nanostructurations